Télécharger le livre :  Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion...

Editeur : Wiley
Parution : 2012-02-17
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Télécharger le livre :  Dielectric Films for Advanced Microelectronics
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced,...

Editeur : Wiley
Parution : 2007-04-04
Collection : Wiley Series in Materials for Electronic & Optoelectronic Applications PDF

263,70

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