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Jiawei Zhang has 10 years of experience working in the development and implementation of advanced packages. He is currently Staff Engineer at Qualcomm, San Diego. Previously, he served as Development Senior Staff Engineer at Broadcom Corporation responsible for IC package co-design flow (Die/Package/System). He is experienced in advanced package, FCBGA, MCM, and SiP. He has published over 30 external papers, including two which won best Conference Paper Awards (2012 IMAPS and 2014 SMTAI) He has
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Téléchargez le livre : Proceedings of the 5th Chinese Conference on High Voltage and Discharge Plasmas
Proceedings of the 5th Chinese Conference on High Voltage and Discharge Plasmas

Jiawei Zhang , Yongdong Li , Anbang Sun , Ming Xu

Springer

2025-09-30

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This book presents articles from the 5th Chinese Conference on High Voltage and Discharge Plasmas, held in Xi'an, China by the Special Committee on Plasma and Its Applications of the Chinese Electrotechnical Society from November 29 to December 1,...

158,24 €

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